Model Number:BGA Reballing Stencil Origin:Mainland China Certification:NONE 50PB 4 Pieces BGA Reballing Stencil for MTK for HTC for Huawei Android Welding Board for iPhone Android Devices Universal Description: brand new and high quality. Feature: These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC. Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use. High success rate of planting tin, the solder balls can be formed once when you are proficient. Simple and convenient to use. BGA Reballing Stencil only, other accessories demo in the picture is not included! Specifications: Item Type: BGA Reballing Stencil Material: Stainless Steel Size: Standard Size Color: Silver Quantity: 4PCS Note: No retail package. Transition: 1cm=10mm=0.39inch Please allow 1-3mm error due to manual measurement. pls make sure you do not mind before you bid. Due to the difference between different monitors, the picture may not reflect the actual color of the item. Thank you! Package Includes: 4 x BGA Reballing Stencils